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Very low capacitance unidirectional quadruple ESD protection diode arrays
Very low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode arrays in small Surface-Mounted Device (SMD) plastic packages designed to protect up to four signal lines from the damage caused by ESD and other transients.
Features and benefits
- ESD protection of up to four lines
- Ultra low leakage current: IRM = 25 nA
- Very low diode capacitance
- ESD protection up to 12 kV
- Max. peak pulse power: PPP = 16 W
- IEC 61000-4-2; level 4 (ESD)
- Low clamping voltage: VCL = 11 V
- IEC 61000-4-5 (surge); IPP = 1.5 A
Applications
- Computers and peripherals
- Communication systems
- Audio and video equipment
- Portable electronics
- Cellular handsets and accessories
- Subscriber Identity Module (SIM) card protection
參數(shù)類型
| 型號 | Package name |
|---|---|
| PESD3V3V4UF | XSON6 |
封裝
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| PESD3V3V4UF | PESD3V3V4UF,115 (934061197115) |
Obsolete |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
環(huán)境信息
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PESD3V3V4UF | PESD3V3V4UF,115 | PESD3V3V4UF |
|
|
文檔 (11)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PESDXV4UF_G_W | Very low capacitance unidirectional quadruple ESD protection diode arrays | Data sheet | 2022-05-03 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| PESD3V3V4UF | PESD3V3V4UF SPICE model | SPICE model | 2012-07-22 |
| PESD3V3V4UF | PESD3V3V4UF SPICE model | SPICE model | 2025-02-03 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| PESD3V3V4UF | PESD3V3V4UF SPICE model | SPICE model | 2012-07-22 |
| PESD3V3V4UF | PESD3V3V4UF SPICE model | SPICE model | 2025-02-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.
PESD3V3V4UF
Very low capacitance unidirectional quadruple ESD protection diode arrays
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