外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8062-1 | HTSSOP | Plastic, thermal enhanced thin shrink small outline package; 8 leads, 0.65 mm pitch, 3 mm × 3 mm × 1.1 mm body | MO-187 (AA) (JEDEC) | 2024-10-29 |
相關(guān)文檔
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT8062-1 | Plastic, thermal enhanced thin shrink small outline package; 8 leads,0.65 mm pitch, 3 mm × 3 mm × 1.1 mm body | Package information | 2024-11-07 |
| SOT8062-1_118 | HTSSOP8; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2024-05-31 |
| SOT8062-1_135 | HTSSOP8; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2024-10-09 |
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|---|---|---|
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| NEX90230BPA-Q100 | 300 mA, 40 V ultra-low Iq (5.3 μA) low-dropout voltage regulator | |
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| NEX90515APA-Q100 | 150 mA, 40 V ultra-low Iq (5.3 μA) low-dropout voltage regulator |