74HC245; 74HCT245
參數(shù)類型
| 型號(hào) | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC245BQ | n.a. | n.a. | CMOS | ± 7.8 | 7.0 | 8 | 36 | low | -40~85 | 76 | 47 | DHVQFN20 |
| 74HC245D | n.a. | n.a. | CMOS | ± 7.8 | 7.0 | 8 | 36 | low | -40~125 | 83 | 59 | SO20 |
| 74HC245PW | n.a. | n.a. | CMOS | ± 7.8 | 7.0 | 8 | 36 | low | -40~125 | 99 | 43.5 | TSSOP20 |
| 74HCT245BQ | n.a. | n.a. | TTL | ± 6 | 10 | 8 | 36 | low | -40~125 | 76 | 47 | DHVQFN20 |
| 74HCT245D | n.a. | n.a. | TTL | ± 6 | 10 | 8 | 36 | low | -40~125 | 83 | 59 | SO20 |
| 74HCT245PW | n.a. | n.a. | TTL | ± 6 | 10 | 8 | 36 | low | -40~125 | 99 | 43.5 | TSSOP20 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC245BQ | 74HC245BQ,115 (935278645115) |
Active | HC245 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HC245D | 74HC245D,653 (933713580653) |
Active | 74HC245D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
暫無信息 |
| 74HC245PW | 74HC245PW,118 (935183570118) |
Active | HC245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74HCT245BQ | 74HCT245BQ,115 (935278646115) |
Active | HCT245 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HCT245D | 74HCT245D,653 (933713590653) |
Active | 74HCT245D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
暫無信息 |
| 74HCT245PW | 74HCT245PW,118 (935165230118) |
Active | HCT245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74HC245D | 74HC245D,652 (933713580652) |
Withdrawn / End-of-life | 74HC245D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
暫無信息 |
| 74HC245DB | 74HC245DB,112 (935166910112) |
Obsolete | HC245 |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
| 74HC245DB,118 (935166910118) |
Obsolete | HC245 | SOT339-1_118 | ||||
| 74HC245PW | 74HC245PW,112 (935183570112) |
Withdrawn / End-of-life | HC245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
| 74HCT245DB | 74HCT245DB,112 (935166900112) |
Obsolete | no package information | ||||
| 74HCT245DB,118 (935166900118) |
Obsolete | ||||||
| 74HCT245PW | 74HCT245PW,112 (935165230112) |
Withdrawn / End-of-life | HCT245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC245BQ | 74HC245BQ,115 | 74HC245BQ |
|
|
| 74HC245D | 74HC245D,653 | 74HC245D |
|
|
| 74HC245PW | 74HC245PW,118 | 74HC245PW |
|
|
| 74HCT245BQ | 74HCT245BQ,115 | 74HCT245BQ |
|
|
| 74HCT245D | 74HCT245D,653 | 74HCT245D |
|
|
| 74HCT245PW | 74HCT245PW,118 | 74HCT245PW |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC245D | 74HC245D,652 | 74HC245D |
|
|
| 74HC245DB | 74HC245DB,112 | 74HC245DB |
|
|
| 74HC245DB | 74HC245DB,118 | 74HC245DB |
|
|
| 74HC245PW | 74HC245PW,112 | 74HC245PW |
|
|
| 74HCT245DB | 74HCT245DB,112 | 74HCT245DB |
|
|
| 74HCT245DB | 74HCT245DB,118 | 74HCT245DB |
|
|
| 74HCT245PW | 74HCT245PW,112 | 74HCT245PW |
|
|
文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74HC_HCT245 | Octal bus transceiver; 3-state | Data sheet | 2024-11-29 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT339-1 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| hc | HC/HCT Spice model | SPICE model | 2022-02-17 |
Ordering, pricing & availability
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