CBTD16211
參數(shù)類型
| 型號(hào) |
|---|
封裝
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| CBTD16211DGG | CBTD16211DGG,112 (935269751112) |
Obsolete | CBTD16211DGG Standard Procedure Standard Procedure |
TSSOP56 (SOT364-1) |
SOT364-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無(wú)信息 |
| CBTD16211DGG,118 (935269751118) |
Obsolete | CBTD16211DGG Standard Procedure Standard Procedure | SOT364-1_118 | ||||
| CBTD16211DL | CBTD16211DL,512 (935269752512) |
Obsolete | CBTD16211DL Standard Procedure Standard Procedure |
SSOP56 (SOT371-1) |
SOT371-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無(wú)信息 |
| CBTD16211DL,518 (935269752518) |
Obsolete | CBTD16211DL Standard Procedure Standard Procedure | 暫無(wú)信息 | ||||
| CBTD16211DL,112 (935269752112) |
Obsolete | CBTD16211DL Standard Procedure Standard Procedure | 暫無(wú)信息 | ||||
| CBTD16211DL,118 (935269752118) |
Obsolete | CBTD16211DL Standard Procedure Standard Procedure | 暫無(wú)信息 |
環(huán)境信息
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBTD16211DGG | CBTD16211DGG,112 | CBTD16211DGG |
|
|
| CBTD16211DGG | CBTD16211DGG,118 | CBTD16211DGG |
|
|
| CBTD16211DL | CBTD16211DL,512 | CBTD16211DL |
|
|
| CBTD16211DL | CBTD16211DL,518 | CBTD16211DL |
|
|
| CBTD16211DL | CBTD16211DL,112 | CBTD16211DL |
|
|
| CBTD16211DL | CBTD16211DL,118 | CBTD16211DL |
|
文檔 (10)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| CBTD16211 | 24-bit level shifting bus exchange switch with 12-bit output enables | Data sheet | 2001-06-12 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT364-1 | 3D model for products with SOT364-1 package | Design support | 2020-01-22 |
| cbtd16211 | cbtd16211 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT364-1 | plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body | Package information | 2022-06-23 |
| SOT371-1 | plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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Ordering, pricing & availability
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