74CBTLV3257
參數(shù)類型
| 型號 | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74CBTLV3257BQ | 2.3?-?3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | 93 | 13.7 | 62 | DHVQFN16 |
| 74CBTLV3257D | 2.3?-?3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | 92 | 9.6 | 52 | SO16 |
| 74CBTLV3257DS | 2.3?-?3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | 148 | 42 | 42 | SSOP16 |
| 74CBTLV3257GU | 2.3?-?3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | XQFN16 | |||
| 74CBTLV3257PW | 2.3?-?3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | 125 | 4.5 | 54.6 | TSSOP16 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74CBTLV3257BQ | 74CBTLV3257BQ,115 (935290004115) |
Active | TV3257 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74CBTLV3257D | 74CBTLV3257D,118 (935290005118) |
Active | 74CBTLV3257D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74CBTLV3257DS | 74CBTLV3257DS,118 (935290006118) |
Active | TLV3257 |
SSOP16 (SOT519-1) |
SOT519-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
SOT519-1_118 |
| 74CBTLV3257GU | 74CBTLV3257GUX (935690113115) |
Active |
XQFN16 (SOT1161-1) |
SOT1161-1 | SOT1161-1_115 | ||
| 74CBTLV3257PW | 74CBTLV3257PW,118 (935290007118) |
Active | TLV3257 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74CBTLV3257BQ | 74CBTLV3257BQ,115 | 74CBTLV3257BQ |
|
|
| 74CBTLV3257D | 74CBTLV3257D,118 | 74CBTLV3257D |
|
|
| 74CBTLV3257DS | 74CBTLV3257DS,118 | 74CBTLV3257DS |
|
|
| 74CBTLV3257GU | 74CBTLV3257GUX | 74CBTLV3257GU |
|
|
| 74CBTLV3257PW | 74CBTLV3257PW,118 | 74CBTLV3257PW |
|
|
文檔 (22)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| 74CBTLV3257 | Quad 1-of-2 multiplexer/demultiplexer | Data sheet | 2024-02-01 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
| SOT1161-1 | 3D model for products with SOT1161-1 package | Design support | 2023-02-07 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| cbtlv3257 | IBIS model of 74CBTLV3257 | IBIS model | 2017-12-11 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT519-1 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | Package information | 2022-06-20 |
| SOT1161-1 | plastic, leadless extermely thin quad flat package; 16 terminals; 0.4 mm pitch; 2.6 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-15 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
| SOT1161-1 | 3D model for products with SOT1161-1 package | Design support | 2023-02-07 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| cbtlv3257 | IBIS model of 74CBTLV3257 | IBIS model | 2017-12-11 |
Ordering, pricing & availability
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