74CB3Q3257
參數(shù)類型
| 型號(hào) | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74CB3Q3257BQ | 2.3?-?3.6 | Vcc | CMOS/LVTTL | 4 | 4 | 0.2 | very low | -40~85 | 84 | 7.3 | 51.5 | DHVQFN16 | |
| 74CB3Q3257PW | 2.3?-?3.6 | Vcc | CMOS/LVTTL | 4 | - | 4 | 0.2 | very low | -40~85 | 116 | 2.4 | 44.3 | TSSOP16 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74CB3Q3257BQ | 74CB3Q3257BQX (935339458115) |
Active | 3Q3257 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74CB3Q3257PW | 74CB3Q3257PWJ (935339459118) |
Active | B3Q3257 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74CB3Q3257BQ | 74CB3Q3257BQX | 74CB3Q3257BQ |
|
|
| 74CB3Q3257PW | 74CB3Q3257PWJ | 74CB3Q3257PW |
|
|
文檔 (12)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74CB3Q3257 | 4-bit 1-of-2 FET multiplexer/demultiplexer with charge pump | Data sheet | 2024-04-11 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| Nexperia_document_leaflet_CB3Q_switches_201803 | CB3Q Bus Switches | Leaflet | 2018-04-06 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
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