化學(xué)成分 PMEG10030ELP-Q

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934662879115	PMEG10030ELP-QX	PMEG10030ELP-Q	SOD128 (FlatPower)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 110696 ppm of the article. SCIP No. e69b8273-820f-4c43-8ec6-8b54a5b7d316.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 1029 ppm; substance 7439-92-1: 110696 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 1029 ppm; substance 7439-92-1: 110696 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 4108 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	1.035000	100.000000	2.729071
		Die Total		1.035000	100.000000	2.729071

Clip	Copper alloy	Copper (Cu)	7440-50-8	6.841095	99.870000	18.038484
Clip	Copper alloy	Iron (Fe)	7439-89-6	0.006850	0.100000	0.018061
Clip	Copper alloy	Phosphorus (P)	7723-14-0	0.002055	0.030000	0.005419
		Clip Total		6.850000	100.000000	18.061964

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	12.160733	99.515000	32.065216
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.011487	0.094000	0.030288
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.004277	0.035000	0.011278
		Base Alloy Total		12.176497	99.644000	32.106782
Lead Frame	Pure metal layer	Copper (Cu)	7440-50-8	0.001222	0.010000	0.003222
		Pre-Plating 1 Total		0.001222	0.010000	0.003222
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.042281	0.346000	0.111486
		Pre-Plating 2 Total		0.042281	0.346000	0.111486
		Lead Frame Total		12.220000	100.000000	32.221490

Mould Compound	Filler	Silica fused	60676-86-0	9.237100	71.000000	24.356230
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	2.562970	19.700000	6.757996
Mould Compound	Polymer	Phenolic resin		1.170900	9.000000	3.087409
Mould Compound	Pigment	Carbon black	1333-86-4	0.039030	0.300000	0.102914
		Mould Compound Total		13.010000	100.000000	34.304549

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.269973	99.990000	0.711860
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000013	0.005000	0.000036
Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.000008	0.003000	0.000021
Post-Plating	Impurity	Copper (Cu)	7440-50-8	0.000003	0.001000	0.000007
Post-Plating	Impurity	Bismuth (Bi)	7440-69-9	0.000003	0.001000	0.000007
		Post-Plating Total		0.270000	100.000000	0.711931

Solder Paste	Lead alloy	Lead (Pb)	7439-92-1	4.198138	92.470000	11.069579
Solder Paste	Lead alloy	Tin (Sn)	7440-31-5	0.227000	5.000000	0.598550
Solder Paste	Lead alloy	Silver (Ag)	7440-22-4	0.113500	2.500000	0.299275
Solder Paste	Impurity	Antimony (Sb)	7440-36-0	0.001362	0.030000	0.003591
		Solder Paste Total		4.540000	100.000000	11.970995

		PMEG10030ELP-Q Total		37.925000	100.000000	100.000000

Notes
Report created on 2024-12-21 22:24:37 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-12-21 22:24:37 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
夾子 (Clip)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預(yù)鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預(yù)鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
錫膏 (Solder Paste)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-21 22:24:37 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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所有產(chǎn)品

雙極性晶體管

二極管

ESD保護(hù)、TVS、信號調(diào)節(jié)

MOSFET

SiC MOSFETs

氮化鎵場效應(yīng)晶體管(GaN FET)

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Interactive application notes

Advanced Support Tools

化學(xué)成分 PMEG10030ELP-Q

雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應(yīng)用認(rèn)證產(chǎn)品(AEC-Q100/Q101)

化學(xué)成分 PMEG10030ELP-Q

ESD保護(hù)、TVS、濾波和信號調(diào)節(jié)ESD保護(hù)