化學(xué)成分 PHDMI2FC4

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過(guò)互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無(wú)鉛狀態(tài)合規(guī)評(píng)估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934667819515	PHDMI2FC4Z	PHDMI2FC4	SOT1165-3 (XSON10)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7439-92-1: 42 ppm; substance 1333-86-4: 2394 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7439-92-1: 42 ppm; substance 1333-86-4: 2394 ppm; substance 7440-43-9: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 4176 ppm; substance 7440-05-3: 17 ppm; substance 7440-57-5: 2 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silica	7631-86-9	0.016800	60.000000	0.402561
Adhesive	Polymer	Resin system		0.011186	39.951410	0.268038
Adhesive	Impurity	Non-declarable		0.000011	0.039500	0.000264
Adhesive	Impurity	Non-declarable		0.000003	0.009090	0.000072
		Adhesive Total		0.028000	100.000000	0.670935

Die	Doped silicon	Silicon (Si)	7440-21-3	0.310000	100.000000	7.428210
		Die Total		0.310000	100.000000	7.428210

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	1.681778	96.487570	40.298710
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	0.040089	2.300000	0.960611
Lead Frame	Copper alloy	Zinc (Zn)	7440-66-6	0.001743	0.100000	0.041766
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.001743	0.100000	0.041766
Lead Frame	Impurity	Lead (Pb)	7439-92-1	0.000174	0.010000	0.004169
Lead Frame	Impurity	Tin (Sn)	7440-31-5	0.000042	0.002430	0.001007
Lead Frame	Impurity	Non-declarable		0.000002	0.000100	0.000048
		Base Alloy Total		1.725571	99.000100	41.348077
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.017429	0.999900	0.417633
		Pre-Plating Total		0.017429	0.999900	0.417633
		Lead Frame Total		1.743000	100.000000	41.765710

Mould Compound	Filler	Silica fused	60676-86-0	1.639180	82.000000	39.277978
Mould Compound	Filler	Silica	7631-86-9	0.159920	8.000000	3.831998
Mould Compound	Polymer	Phenolic resin		0.079960	4.000000	1.915999
Mould Compound	Polymer	Epoxy resin system		0.079960	4.000000	1.915999
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.029985	1.500000	0.718499
Mould Compound	Pigment	Carbon black	1333-86-4	0.009995	0.500000	0.239500
		Mould Compound Total		1.999000	100.000000	47.899973

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.090993	99.991800	2.180371
Post-Plating	Tin alloy	Lead (Pb)	7439-92-1	0.000003	0.003500	0.000072
Post-Plating	Tin alloy	Bismuth (Bi)	7440-69-9	0.000002	0.001700	0.000048
Post-Plating	Tin alloy	Iron (Fe)	7439-89-6	0.000001	0.000800	0.000024
Post-Plating	Tin alloy	Antimony (Sb)	7440-36-0	0.000001	0.000900	0.000024
Post-Plating	Tin alloy	Aluminium (Al)	7429-90-5	0.000000	0.000100	0.000000
Post-Plating	Tin alloy	Copper (Cu)	7440-50-8	0.000000	0.000300	0.000000
Post-Plating	Tin alloy	Zinc (Zn)	7440-66-6	0.000000	0.000100	0.000000
Post-Plating	Tin alloy	Arsenic (As)	7440-38-2	0.000000	0.000500	0.000000
Post-Plating	Tin alloy	Cadmium (Cd)	7440-43-9	0.000000	0.000300	0.000000
		Post-Plating Total		0.091000	100.000000	2.180539

Wire	Copper alloy	Copper (Cu)	7440-50-8	0.002201	96.540348	0.052740
Wire	Impurity	Non-declarable		0.000000	0.009659	0.000000
Wire	Impurity	Non-declarable		0.000000	0.000998	0.000000
Wire	Impurity	Non-declarable		0.000000	0.000998	0.000000
Wire	Pure metal layer	Palladium (Pd)	7440-05-3	0.000071	3.098999	0.001701
		Wire Coating 1 Total		0.000071	3.098999	0.001701
Wire	Pure metal layer	Gold (Au)	7440-57-5	0.000008	0.348998	0.000192
		Wire Coating 2 Total		0.000008	0.348998	0.000192
		Wire Total		0.002280	100.000000	0.054633

		PHDMI2FC4 Total		4.173280		100.000000

Notes
Report created on 2025-01-12 11:38:17 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-01-12 11:38:17 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價(jià)鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)	?	?	?	?	?	?
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預(yù)鍍層 (Pre-Plating)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?
導(dǎo)線涂層1 (Wire Coating 1)	?	?	?	?	?	?
導(dǎo)線涂層2 (Wire Coating 2)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導(dǎo)體產(chǎn)品具有無(wú)限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-01-12 11:38:17 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學(xué)成分 PHDMI2FC4

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