化學(xué)成分 BSS84AKS

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934065308115	BSS84AKS,115	BSS84AKS	SOT363 (SC-88)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 135654 ppm; substance 7440-48-4: 1633 ppm; substance 1333-86-4: 267 ppm; substance 7439-92-1: 3 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 135654 ppm; substance 7440-48-4: 1633 ppm; substance 1333-86-4: 267 ppm; substance 7439-92-1: 3 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-57-5: 944 ppm; substance 7440-22-4: 7066 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	0.072824	91.030000	1.336434
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.002032	2.540000	0.037291
		Die Metallization 1 Total		0.002032	2.540000	0.037291
Die	Pure metal layer	Gold (Au)	7440-57-5	0.005144	6.430000	0.094400
		Die Metallization 2 Total		0.005144	6.430000	0.094400
		Die Total		0.080000	100.000000	1.468125

Lead Frame	Iron-nickel alloy	Iron (Fe)	7439-89-6	0.981180	47.400000	18.006190
Lead Frame	Iron-nickel alloy	Nickel (Ni)	7440-02-0	0.739197	35.710000	13.565423
Lead Frame	Iron-nickel alloy	Manganese (Mn)	7439-96-5	0.017595	0.850000	0.322896
Lead Frame	Iron-nickel alloy	Cobalt (Co)	7440-48-4	0.008901	0.430000	0.163347
Lead Frame	Iron-nickel alloy	Silicon (Si)	7440-21-3	0.005382	0.260000	0.098768
Lead Frame	Iron-nickel alloy	Chromium (Cr)	7440-47-3	0.004347	0.210000	0.079774
Lead Frame	Iron-nickel alloy	Aluminium (Al)	7429-90-5	0.001863	0.090000	0.034189
Lead Frame	Iron-nickel alloy	Carbon (C)	7440-44-0	0.000828	0.040000	0.015195
Lead Frame	Iron-nickel alloy	Sulfur (S)	7704-34-9	0.000414	0.020000	0.007598
Lead Frame	Iron-nickel alloy	Phosphorus (P)	7723-14-0	0.000414	0.020000	0.007598
		Base Alloy Total		1.760121	85.030000	32.300978
Lead Frame	Pure metal layer	Copper (Cu)	7440-50-8	0.271377	13.110000	4.980193
		Pre-Plating 1 Total		0.271377	13.110000	4.980193
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.038502	1.860000	0.706572
		Pre-Plating 2 Total		0.038502	1.860000	0.706572
		Lead Frame Total		2.070000	100.000000	37.987743

Mould Compound	Filler	Silica	7631-86-9	2.102400	72.000000	38.582332
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	0.438000	15.000000	8.037986
Mould Compound	Polymer	Formaldehyde-phenol copolymer	9003-35-4	0.292000	10.000000	5.358658
Mould Compound	Additive	Non-declarable		0.084680	2.900000	1.554012
Mould Compound	Pigment	Carbon black	1333-86-4	0.001460	0.050000	0.026794
Mould Compound	Additive	Triphenylphosphine	603-35-0	0.001460	0.050000	0.026793
		Mould Compound Total		2.920000	100.000000	53.586575

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.369963	99.990000	6.789400
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000018	0.005000	0.000340
Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.000011	0.003000	0.000204
Post-Plating	Impurity	Copper (Cu)	7440-50-8	0.000004	0.001000	0.000068
Post-Plating	Impurity	Bismuth (Bi)	7440-69-9	0.000004	0.001000	0.000068
		Post-Plating Total		0.370000	100.000000	6.790080

Wire	Pure metal	Copper (Cu)	7440-50-8	0.009126	100.000000	0.167477
		Wire Total		0.009126	100.000000	0.167477

		BSS84AKS Total		5.449126	100.000000	100.000000

Notes
Report created on 2024-12-21 22:16:51 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2024-12-21 22:16:51 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價(jià)鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層1 (Die Metallization 1)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層2 (Die Metallization 2)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預(yù)鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預(yù)鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2024-12-21 22:16:51 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學(xué)成分 BSS84AKS

雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場效應(yīng)晶體管(GaN FET)

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化學(xué)成分 BSS84AKS

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)