74AHC244; 74AHCT244
參數(shù)類(lèi)型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC244BQ | 2.0?-?5.5 | CMOS | ± 8 | 60 | 8 | low | -40~125 | 78 | 50 | DHVQFN20 |
| 74AHC244D | 2.0?-?5.5 | CMOS | ± 8 | 60 | 8 | low | -40~125 | 85 | 61 | SO20 |
| 74AHC244PW | 2.0?-?5.5 | CMOS | ± 8 | 60 | 8 | low | -40~125 | 100 | 44.7 | TSSOP20 |
| 74AHCT244BQ | 4.5?-?5.5 | TTL | ± 8 | 60 | 8 | low | -40~125 | 78 | 50 | DHVQFN20 |
| 74AHCT244D | 4.5?-?5.5 | TTL | ± 8 | 60 | 8 | low | -40~125 | 85 | 61 | SO20 |
| 74AHCT244PW | 4.5?-?5.5 | TTL | ± 8 | 60 | 8 | low | -40~125 | 100 | 44.7 | TSSOP20 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC244BQ | 74AHC244BQ,115 (935285537115) |
Active | AHC244 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74AHC244D | 74AHC244D,118 (935262001118) |
Active | 74AHC244D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHC244PW | 74AHC244PW,118 (935262002118) |
Active | AHC244 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74AHCT244BQ | 74AHCT244BQ,115 (935285541115) |
Active | AHCT244 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74AHCT244D | 74AHCT244D,118 (935261957118) |
Active | 74AHCT244D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHCT244PW | 74AHCT244PW,118 (935261959118) |
Active | AHCT244 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC244PW | 74AHC244PW,112 (935262002112) |
Withdrawn / End-of-life | AHC244 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無(wú)信息 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC244BQ | 74AHC244BQ,115 | 74AHC244BQ |
|
|
| 74AHC244D | 74AHC244D,118 | 74AHC244D |
|
|
| 74AHC244PW | 74AHC244PW,118 | 74AHC244PW |
|
|
| 74AHCT244BQ | 74AHCT244BQ,115 | 74AHCT244BQ |
|
|
| 74AHCT244D | 74AHCT244D,118 | 74AHCT244D |
|
|
| 74AHCT244PW | 74AHCT244PW,118 | 74AHCT244PW |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC244PW | 74AHC244PW,112 | 74AHC244PW |
|
|
文檔 (16)
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT244 | Octal buffer/line driver; 3-state | Data sheet | 2023-09-20 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc244 | ahc244 IBIS model | IBIS model | 2013-04-08 |
| ahct244 | ahct244 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc244 | ahc244 IBIS model | IBIS model | 2013-04-08 |
| ahct244 | ahct244 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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