參數類型
| 型號 |
|---|
封裝
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| CBT3245ABQ | CBT3245ABQ,115 (935281788115) |
Obsolete | CT3245A |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| CBT3245ABQ,118 (935281788118) |
Obsolete | CT3245A | 暫無信息 | ||||
| CBT3245AD | CBT3245AD,112 (935271059112) |
Obsolete | no package information | ||||
| CBT3245AD,118 (935271059118) |
Obsolete | ||||||
| CBT3245ADB | CBT3245ADB,112 (935271056112) |
Obsolete | CT3245A |
SSOP20 (SOT339-1) |
SOT339-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 |
| CBT3245ADB,118 (935271056118) |
Obsolete | CT3245A | SOT339-1_118 | ||||
| CBT3245APW | CBT3245APW,112 (935271055112) |
Obsolete |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
暫無信息 | |
| CBT3245APW,118 (935271055118) |
Obsolete | SOT360-1_118 | |||||
環(huán)境信息
下表中的所有產品型號均已停產 。
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBT3245ABQ | CBT3245ABQ,115 | CBT3245ABQ |
|
|
| CBT3245ABQ | CBT3245ABQ,118 | CBT3245ABQ |
|
|
| CBT3245AD | CBT3245AD,112 | CBT3245AD |
|
|
| CBT3245AD | CBT3245AD,118 | CBT3245AD |
|
|
| CBT3245ADB | CBT3245ADB,112 | CBT3245ADB |
|
|
| CBT3245ADB | CBT3245ADB,118 | CBT3245ADB |
|
|
| CBT3245APW | CBT3245APW,112 | CBT3245APW |
|
|
| CBT3245APW | CBT3245APW,118 | CBT3245APW |
|
|
文檔 (14)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| CBT3245A | Octal bus switch | Data sheet | 2022-03-21 |
| AN90010 | Pin FMEA for CBT(D) family | Application note | 2019-10-28 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| cbt3245a | CBT3245A IBIS model | IBIS model | 2019-01-09 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT339-1 | plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body | Package information | 2020-04-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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