外形圖
| 封裝版本 | 封裝名稱 | 封裝說明 | 參考 | 發(fā)行日期 |
|---|---|---|---|---|
| SOT8022 | TO-247-2 | Plastic, single-ended package (heatsink mounted, 1 mounting hole) (TO-247-2); 2 leads; 10.88 mm pitch; 20.95 mm x 15.94 mm x 5.02 mm body | TO-247-2 (JEDEC) | 2021-02-10 |
相關(guān)文檔
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-06-13 |
| SOT8022 | 3D model for products with SOT8022 package | Design support | 2023-03-13 |
| SOT8022 | Plastic, single-ended package (heatsink mounted, 1 mounting hole) (TO-247-2); 2 leads; 10.88 mm pitch; 20.95 mm x 15.94 mm x 5.02 mm body | Package information | 2021-11-03 |
| TN90007 | Evaluation of junction temperature and thermal stacks using the virtual junction | Technical note | 2024-09-02 |