74CBTLV3257-Q100
參數(shù)類(lèi)型
| 型號(hào) | VCC (V) | RON (Ω) | Logic switching levels | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74CBTLV3257BQ-Q100 | 2.3?-?3.6 | 7 | CMOS/LVTTL | 0.2 | very low | -40~125 | 93 | 13.7 | 62 | DHVQFN16 |
| 74CBTLV3257D-Q100 | 2.3?-?3.6 | 7 | CMOS/LVTTL | 0.2 | very low | -40~125 | 92 | 9.6 | 52 | SO16 |
| 74CBTLV3257PW-Q100 | 2.3?-?3.6 | 7 | CMOS/LVTTL | 0.2 | very low | -40~125 | 125 | 4.5 | 54.6 | TSSOP16 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74CBTLV3257BQ-Q100 | 74CBTLV3257BQ-Q10X (935302227115) |
Active | TV3257 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74CBTLV3257D-Q100 | 74CBTLV3257D-Q100J (935302231118) |
Active | 74CBTLV3257D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74CBTLV3257PW-Q100 | 74CBTLV3257PW-Q10J (935302229118) |
Active | TLV3257 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74CBTLV3257BQ-Q100 | 74CBTLV3257BQ-Q10X | 74CBTLV3257BQ-Q100 |
|
|
| 74CBTLV3257D-Q100 | 74CBTLV3257D-Q100J | 74CBTLV3257D-Q100 |
|
|
| 74CBTLV3257PW-Q100 | 74CBTLV3257PW-Q10J | 74CBTLV3257PW-Q100 |
|
|
文檔 (18)
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| 74CBTLV3257_Q100 | Quad 1-of-2 multiplexer/demultiplexer | Data sheet | 2024-02-01 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| cbtlv3257 | IBIS model of 74CBTLV3257 | IBIS model | 2017-12-11 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱(chēng) | 標(biāo)題 | 類(lèi)型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| cbtlv3257 | IBIS model of 74CBTLV3257 | IBIS model | 2017-12-11 |
Ordering, pricing & availability
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