XS3A1T3157
參數(shù)類型
| 型號 | Configuration | VCC (V) | Logic switching levels | RON (Ω) | RON(FLAT) (Ω) | f(-3dB) (MHz) | THD (%) | Xtalk (dB) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XS3A1T3157GM | SPDT-Z | 1.4?-?4.3 | CMOS/LVTTL | 0.5 | 0.2 | 40 | 0.03 | -90 | ultra low | -40~125 | 247 | 119 | XSON6 |
| XS3A1T3157GS | SPDT-Z | 1.4?-?4.3 | CMOS/LVTTL | 0.5 | 0.2 | 40 | 0.03 | -90 | ultra low | -40~125 | 247 | 193 | XSON6 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| XS3A1T3157GM | XS3A1T3157GMX (935690968115) |
Active | aL |
XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
| XS3A1T3157GS | XS3A1T3157GSH (935690969125) |
Active | aL |
XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暫無信息 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| XS3A1T3157GM | XS3A1T3157GMX | XS3A1T3157GM |
|
|
| XS3A1T3157GS | XS3A1T3157GSH | XS3A1T3157GS |
|
|
文檔 (14)
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| XS3A1T3157 | Low-ohmic single-pole double-throw analog switch | Data sheet | 2024-07-31 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| xs3a1t3157 | XS3A1T3157 IBIS model | IBIS model | 2020-09-11 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
支持
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模型
| 文件名稱 | 標題 | 類型 | 日期 |
|---|---|---|---|
| SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
| SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
| xs3a1t3157 | XS3A1T3157 IBIS model | IBIS model | 2020-09-11 |
Ordering, pricing & availability
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