74AHC1G14; 74AHCT1G14
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC1G14GV | 2.0?-?5.5 | CMOS | ± 8 | 60 | 1 | low | -40~125 | 282 | 177 | TSOP5 |
| 74AHC1G14GW | 2.0?-?5.5 | CMOS | ± 8 | 60 | 1 | low | -40~125 | 322 | 191 | TSSOP5 |
| 74AHCT1G14GV | 4.5?-?5.5 | TTL | ± 8 | 60 | 1 | low | -40~125 | 282 | 177 | TSOP5 |
| 74AHCT1G14GW | 4.5?-?5.5 | TTL | ± 8 | 60 | 1 | low | -40~125 | 322 | 191 | TSSOP5 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC1G14GV | 74AHC1G14GV,125 (935271665125) |
Active | A14 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
| 74AHC1G14GW | 74AHC1G14GW,125 (935263009125) |
Active | AF |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74AHCT1G14GV | 74AHCT1G14GV,125 (935271664125) |
Active | C14 |
TSOP5 (SOT753) |
SOT753 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT753_125 |
| 74AHCT1G14GW | 74AHCT1G14GW,125 (935263008125) |
Active | CF |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC1G14GV | 74AHC1G14GV,125 | 74AHC1G14GV |
|
|
| 74AHC1G14GW | 74AHC1G14GW,125 | 74AHC1G14GW |
|
|
| 74AHCT1G14GV | 74AHCT1G14GV,125 | 74AHCT1G14GV |
|
|
| 74AHCT1G14GW | 74AHCT1G14GW,125 | 74AHCT1G14GW |
|
|
文檔 (13)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT1G14 | Inverting Schmitt trigger | Data sheet | 2024-11-12 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT753 | 3D model for products with SOT753 package | Design support | 2019-01-22 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| ahc1g14 | ahc1g14 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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