74LVC161
參數(shù)類型
| 型號(hào) | VCC (V) | Output drive capability (mA) | Logic switching levels | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74LVC161BQ | 1.2?-?3.6 | ± 24 | CMOS/LVTTL | 4.9 | low | -40~125 | 93 | 13.8 | 62 | DHVQFN16 |
| 74LVC161D | 1.2?-?3.6 | ± 24 | CMOS/LVTTL | 4.9 | low | -40~125 | 92 | 9.6 | 51.7 | SO16 |
| 74LVC161PW | 1.2?-?3.6 | ± 24 | CMOS/LVTTL | 4.9 | low | -40~125 | 125 | 4.6 | 54.7 | TSSOP16 |
封裝
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC161BQ | 74LVC161BQ,115 (935275612115) |
Active | LVC161 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74LVC161D | 74LVC161D,118 (935210510118) |
Active | 74LVC161D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74LVC161PW | 74LVC161PW,118 (935210530118) |
Active | LVC161 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào)，（訂購(gòu)碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LVC161D | 74LVC161D,112 (935210510112) |
Withdrawn / End-of-life | 74LVC161D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_112 |
| 74LVC161DB | 74LVC161DB,112 (935210520112) |
Obsolete |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暫無(wú)信息 | |
| 74LVC161DB,118 (935210520118) |
Withdrawn / End-of-life | 暫無(wú)信息 |
環(huán)境信息
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC161BQ | 74LVC161BQ,115 | 74LVC161BQ |
|
|
| 74LVC161D | 74LVC161D,118 | 74LVC161D |
|
|
| 74LVC161PW | 74LVC161PW,118 | 74LVC161PW |
|
|
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購(gòu)的器件編號(hào) | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74LVC161D | 74LVC161D,112 | 74LVC161D |
|
|
| 74LVC161DB | 74LVC161DB,112 | 74LVC161DB |
|
|
| 74LVC161DB | 74LVC161DB,118 | 74LVC161DB |
|
|
文檔 (25)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LVC161 | Presettable synchronous 4-bit binary counter; asynchronous reset | Data sheet | 2024-02-12 |
| AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
| AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| mna907 | Block diagram: 74HC161D, 74HC161DB, 74HC161N, 74HC161PW, 74HC163D, 74HC163DB, 74HC163N, 74HC163PW, 74HCT161D, 74HCT161DB, 74HCT161N, 74HCT161PW, 74HCT163D, 74HCT163DB, 74HCT163N, 74HCT163PW, 74LVC161BQ, 74LVC161D, 74LVC161DB, 74LVC161PW | Block diagram | 2009-11-03 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| lvc161 | lvc161 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT338-1 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2022-06-20 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| lvc161 | lvc161 IBIS model | IBIS model | 2013-04-08 |
| lvc | lvc Spice model | SPICE model | 2013-05-07 |
Ordering, pricing & availability
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