74LV08
參數(shù)類型
| 型號(hào) | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74LV08D | 1.0?-?5.5 | TTL | ± 12 | 7.0 | 30 | 4 | low | -40~125 | 87 | 6.6 | 45 | SO14 |
| 74LV08PW | 1.0?-?5.5 | TTL | ± 12 | 7.0 | 30 | 4 | low | -40~125 | 127 | 3.1 | 51.4 | TSSOP14 |
封裝
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LV08D | 74LV08D,118 (935063150118) |
Active | 74LV08D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
| 74LV08PW | 74LV08PW,118 (935174280118) |
Active | LV08 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有產(chǎn)品型號(hào)均已停產(chǎn) 。
| 型號(hào) | 可訂購的器件編號(hào)，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74LV08DB | 74LV08DB,112 (935169270112) |
Obsolete | no package information | ||||
| 74LV08DB,118 (935169270118) |
Obsolete | ||||||
文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74LV08 | Quad 2-input AND gate | Data sheet | 2024-01-30 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| mna221 | Block diagram: 74AHC08BQ, 74AHC08D, 74AHC08PW, 74AHC2G08DC, 74AHC2G08DP, 74AHC2G08GD, 74AHCT08BQ, 74AHCT08D, 74AHCT08PW, 74AHCT2G08DC, 74AHCT2G08DP, 74AHCT2G08GD, 74AUP1G08GF, 74AUP1G08GM, 74AUP1G08GW, 74HC2G08DC, 74HC2G08DP, 74HC2G08GD, 74HCT2G08DC, 74HCT2G08DP, 74HCT2G08GD, 74LV08D, 74LV08DB, 74LV08N, 74LV08PW, 74LV125D, 74LV125DB, 74LV125N, 74LV125PW | Block diagram | 2009-11-03 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| 74lv08 | 74lv08 IBIS model | IBIS model | 2016-05-25 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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