74AHC245; 74AHCT245
參數(shù)類型
| 型號 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AHC245BQ | n.a. | n.a. | CMOS | ± 8 | 3.5 | 8 | 60 | low | -40~125 | 75 | 47 | DHVQFN20 |
| 74AHC245D | n.a. | n.a. | CMOS | ± 8 | 3.5 | 8 | 60 | low | -40~125 | 83 | 59 | SO20 |
| 74AHC245PW | n.a. | n.a. | CMOS | ± 8 | 3.5 | 8 | 60 | low | -40~125 | 99 | 43.3 | TSSOP20 |
| 74AHCT245APW | n.a. | n.a. | TTL | ± 8 | 3.0 | 8 | 60 | low | -40~125 | 101 | 45 | TSSOP20 |
| 74AHCT245BQ | n.a. | n.a. | TTL | ± 8 | 5.0 | 8 | 60 | low | -40~125 | 75 | 47 | DHVQFN20 |
| 74AHCT245D | n.a. | n.a. | TTL | ± 8 | 5.0 | 8 | 60 | low | -40~125 | 83 | 59 | SO20 |
| 74AHCT245PW | n.a. | n.a. | TTL | ± 8 | 5.0 | 8 | 60 | low | -40~125 | 99 | 43.3 | TSSOP20 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC245BQ | 74AHC245BQ,115 (935289107115) |
Active | AHC245 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74AHC245D | 74AHC245D,118 (935262003118) |
Active | 74AHC245D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHC245PW | 74AHC245PW,118 (935262005118) |
Active | AHC245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74AHCT245APW | 74AHCT245APWJ (935307876118) |
Active | AHT245A |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
| 74AHCT245BQ | 74AHCT245BQ,115 (935289108115) |
Active | AHCT245 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74AHCT245D | 74AHCT245D,118 (935261960118) |
Active | 74AHCT245D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
SOT163-1_118 |
| 74AHCT245PW | 74AHCT245PW,118 (935261962118) |
Active | AHCT245 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AHC245D | 74AHC245D,112 (935262003112) |
Withdrawn / End-of-life | 74AHC245D |
SO20 (SOT163-1) |
SOT163-1 |
WAVE_BG-BD-1
|
暫無信息 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AHC245BQ | 74AHC245BQ,115 | 74AHC245BQ |
|
|
| 74AHC245D | 74AHC245D,118 | 74AHC245D |
|
|
| 74AHC245PW | 74AHC245PW,118 | 74AHC245PW |
|
|
| 74AHCT245APW | 74AHCT245APWJ | 74AHCT245APW |
|
|
| 74AHCT245BQ | 74AHCT245BQ,115 | 74AHCT245BQ |
|
|
| 74AHCT245D | 74AHCT245D,118 | 74AHCT245D |
|
|
| 74AHCT245PW | 74AHCT245PW,118 | 74AHCT245PW |
|
|
下表中的所有產(chǎn)品型號均已停產(chǎn) 。
品質(zhì)及可靠性免責(zé)聲明文檔 (16)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AHC_AHCT245 | Octal bus transceiver; 3-state | Data sheet | 2023-09-21 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| mna174 | Block diagram: 74AHC245D, 74AHC245PW, 74AHCT245D, 74AHCT245PW, 74LV245D, 74LV245DB, 74LV245N, 74LV245PW, 74AHC245D, 74AHC245PW, 74AHCT245D, 74AHCT245PW, 74ALVC245BQ, 74ALVC245D, 74ALVC245PW, 74LVC2245ABQ, 74LVC2245AD, 74LVC2245ADB, 74LVC2245APW, 74LVC245ABQ, 74LVC245ABX, 74LVC245AD, 74LVC245ADB, 74LVC245APW, 74LVCH245ABQ, 74LVCH245ABX, 74LVCH245AD, 74LVCH245ADB, 74LVCH245APW | Block diagram | 2009-11-04 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc245 | ahc245 IBIS model | IBIS model | 2013-04-08 |
| ahct245 | ahct245 IBIS model | IBIS model | 2013-04-08 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2024-11-15 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT163-1 | 3D model for products with SOT163-1 package | Design support | 2020-01-22 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| ahc245 | ahc245 IBIS model | IBIS model | 2013-04-08 |
| ahct245 | ahct245 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
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