74AUP1T17
參數(shù)類型
| 型號 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP1T17GW | 2.3?-?3.6 | CMOS | ± 4 | 70 | 1 | ultra low | -40~125 | 316 | 86 | 186 | TSSOP5 |
| 74AUP1T17GX | 2.3?-?3.6 | CMOS | ± 4 | 70 | 1 | ultra low | -40~125 | 340 | 105 | 206 | X2SON5 |
封裝
| 型號 | 可訂購的器件編號，（訂購碼(12NC)） | 狀態(tài) | 標(biāo)示 | 封裝 | 外形圖 | 回流焊/波峰焊 | 包裝 |
|---|---|---|---|---|---|---|---|
| 74AUP1T17GW | 74AUP1T17GWH (935690081125) |
Active | 57 |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74AUP1T17GX | 74AUP1T17GXH (935690082125) |
Active | 57 |
X2SON5 (SOT1226-3) |
SOT1226-3 | SOT1226-3_125 |
環(huán)境信息
| 型號 | 可訂購的器件編號 | 化學(xué)成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP1T17GW | 74AUP1T17GWH | 74AUP1T17GW |
|
|
| 74AUP1T17GX | 74AUP1T17GXH | 74AUP1T17GX |
|
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文檔 (15)
| 文件名稱 | 標(biāo)題 | 類型 | 日期 |
|---|---|---|---|
| 74AUP1T17 | Low-power buffer with voltage-level translator | Data sheet | 2023-07-26 |
| AN90063 | Questions about package outline drawings | Application note | 2025-03-12 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1226-3 | 3D model for products with SOT1226-3 package | Design support | 2021-01-28 |
| aup1t17 | IBIS model of 74AUP1T17 | IBIS model | 2017-12-18 |
| Nexperia_74AUP1Txx_voltage_translators | Single supply logic gates with voltage translation | Leaflet | 2018-06-18 |
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
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