化學(xué)成分 PMDPB55XP

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評(píng)估?？蛻艨梢灾苯訌囊话惝a(chǎn)品數(shù)據(jù)庫(kù)檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國(guó)RoHS。詳細(xì)資料請(qǐng)見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934066506115	PMDPB55XP,115	PMDPB55XP	SOT1118 (HUSON6)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 14414 ppm; substance 1333-86-4: 2663 ppm; substance 7439-92-1: <1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 14414 ppm; substance 1333-86-4: 2663 ppm; substance 7439-92-1: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 8549 ppm; substance 7440-05-3: 259 ppm; substance 7440-57-5: 21777 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.062400	80.000000	0.854862
Adhesive	Polymer	Poly(isobornyl) methacrylate	64114-51-8	0.007800	10.000000	0.106858
Adhesive	Polymer	Bismaleimide resin		0.006825	8.750000	0.093500
Adhesive	Polymer	Polysiloxanes	63148-53-8	0.000780	1.000000	0.010686
Adhesive	Polymer	Acrylic resin		0.000187	0.240000	0.002562
Adhesive	Curing accelerators/Catalyst	Palladium (Pd)	7440-05-3	0.000008	0.010000	0.000110
		Adhesive Total		0.078000	100.000000	1.068578

Die	Doped silicon	Silicon (Si)	7440-21-3	0.319104	99.720000	4.371635
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.000896	0.280000	0.012275
		Die Metallization Total		0.000896	0.280000	0.012275
		Die Total		0.320000	100.000000	4.383910

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	2.559410	95.110000	35.063197
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	0.085305	3.170000	1.168655
Lead Frame	Copper alloy	Silicon (Si)	7440-21-3	0.018568	0.690000	0.254376
Lead Frame	Copper alloy	Magnesium (Mg)	7439-95-4	0.005382	0.200000	0.073732
		Base Alloy Total		2.668665	99.170000	36.559960
Lead Frame	Pure metal layer	Gold (Au)	7440-57-5	0.000538	0.020000	0.007370
		Pre-Plating 1 Total		0.000538	0.020000	0.007370
Lead Frame	Pure metal layer	Palladium (Pd)	7440-05-3	0.001884	0.070000	0.025810
		Pre-Plating 2 Total		0.001884	0.070000	0.025810
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.019913	0.740000	0.272803
		Pre-Plating 3 Total		0.019913	0.740000	0.272803
		Lead Frame Total		2.691000	100.000000	36.865943

Mould Compound	Filler	Silica fused	60676-86-0	2.332800	60.000000	31.958704
Mould Compound	Filler	Silica	7631-86-9	0.894240	23.000000	12.250836
Mould Compound	Polymer	Epoxy resin system		0.272160	7.000000	3.728515
Mould Compound	Polymer	Phenolic resin		0.233280	6.000000	3.195870
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.116640	3.000000	1.597935
Mould Compound	Pigment	Carbon black	1333-86-4	0.019440	0.500000	0.266323
Mould Compound	Ion trapping agent	Bismuth (Bi)	7440-69-9	0.019440	0.500000	0.266323
		Mould Compound Total		3.888000	100.000000	53.264506

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.163902	99.940000	2.245411
Post-Plating	Impurity	Non-declarable		0.000091	0.055500	0.001247
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000007	0.004500	0.000096
		Post-Plating Total		0.164000	100.000000	2.246754

Wire 1	Pure metal	Gold (Au)	7440-57-5	0.144020	100.000000	1.973033
		Wire Total		0.144020	100.000000	1.973033
		Wire 1 Total		0.144020	100.000000	1.973033

Wire 2	Pure metal	Gold (Au)	7440-57-5	0.014399	99.990000	0.197262
Wire 2	Impurity	Non-declarable		0.000001	0.010000	0.000014
		Wire Total		0.014400	100.000000	0.197276
		Wire 2 Total		0.014400	100.000000	0.197276

		PMDPB55XP Total		7.299420		100.000000

Notes
Report created on 2025-03-24 13:59:24 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-03-24 13:59:24 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價(jià)鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)	?	?	?	?	?	?
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層 (Die Metallization)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預(yù)鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預(yù)鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
預(yù)鍍層3 (Pre-Plating 3)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-03-24 13:59:24 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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Interactive application notes

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化學(xué)成分 PMDPB55XP

雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

MOSFET

氮化鎵場(chǎng)效應(yīng)晶體管(GaN FET)

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模擬和邏輯IC

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化學(xué)成分 PMDPB55XP

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)