化學成分 PMCXB900UEL

作為一家積極進取的可持續(xù)發(fā)展公司，安世半導體已決定直接通過互聯(lián)網發(fā)布其產品組合的化學成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關資料，以協(xié)助他們進行RoHS指令或無鉛狀態(tài)合規(guī)評估?？蛻艨梢灾苯訌囊话惝a品數(shù)據(jù)庫檢索中獲取這些詳細的數(shù)據(jù)，這是安世半導體為半導體產業(yè)設下的一個行業(yè)標準。安世半導體產品符合歐盟RoHS指令、ELV和中國RoHS。詳細資料請見限用物質聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934070417147	PMCXB900UELZ	PMCXB900UEL	SOT1216 (DFN1010B-6)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 30378 ppm; substance 1333-86-4: 2489 ppm; substance 7439-92-1: <1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 30378 ppm; substance 1333-86-4: 2489 ppm; substance 7439-92-1: <1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 14461 ppm; substance 7440-05-3: 1736 ppm; substance 7440-57-5: 11829 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Adhesive	Filler	Silver (Ag)	7440-22-4	0.017600	80.000000	1.446115
Adhesive	Polymer	Poly(isobornyl) methacrylate	64114-51-8	0.002200	10.000000	0.180764
Adhesive	Polymer	Bismaleimide resin		0.001925	8.750000	0.158169
Adhesive	Polymer	Polysiloxanes	63148-53-8	0.000220	1.000000	0.018077
Adhesive	Polymer	Acrylic resin		0.000053	0.240000	0.004355
Adhesive	Curing accelerators/Catalyst	Palladium (Pd)	7440-05-3	0.000002	0.010000	0.000164
		Adhesive Total		0.022000	100.000000	1.807644

Die 1	Doped silicon	Silicon (Si)	7440-21-3	0.030000	100.000000	2.464969
		Die Total		0.030000	100.000000	2.464969
		Die 1 Total		0.030000	100.000000	2.464969

Die 2	Doped silicon	Silicon (Si)	7440-21-3	0.030000	100.000000	2.464969
		Die Total		0.030000	100.000000	2.464969
		Die 2 Total		0.030000	100.000000	2.464969

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	0.447694	91.180000	36.785056
Lead Frame	Copper alloy	Nickel (Ni)	7440-02-0	0.013944	2.840000	1.145718
Lead Frame	Copper alloy	Silicon (Si)	7440-21-3	0.003044	0.620000	0.250112
Lead Frame	Copper alloy	Magnesium (Mg)	7439-95-4	0.000835	0.170000	0.068608
		Base Alloy Total		0.465517	94.810000	38.249494
Lead Frame	Pure metal layer	Gold (Au)	7440-57-5	0.000344	0.070000	0.028265
		Pre-Plating 1 Total		0.000344	0.070000	0.028265
Lead Frame	Pure metal layer	Palladium (Pd)	7440-05-3	0.002111	0.430000	0.173452
		Pre-Plating 2 Total		0.002111	0.430000	0.173452
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.023028	4.690000	1.892110
		Pre-Plating 3 Total		0.023028	4.690000	1.892110
		Lead Frame Total		0.491000	100.000000	40.343321

Mould Compound	Filler	Silica fused	60676-86-0	0.363600	60.000000	29.875420
Mould Compound	Filler	Silica	7631-86-9	0.139380	23.000000	11.452244
Mould Compound	Polymer	Epoxy resin system		0.042420	7.000000	3.485466
Mould Compound	Polymer	Phenolic resin		0.036360	6.000000	2.987542
Mould Compound	Flame retardant	Aluminium hydroxide (Al(OH)3)	21645-51-2	0.018180	3.000000	1.493771
Mould Compound	Pigment	Carbon black	1333-86-4	0.003030	0.500000	0.248962
Mould Compound	Ion trapping agent	Bismuth (Bi)	7440-69-9	0.003030	0.500000	0.248962
		Mould Compound Total		0.606000	100.000000	49.792367

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.023986	99.940000	1.970825
Post-Plating	Impurity	Non-declarable		0.000013	0.055500	0.001068
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000001	0.004500	0.000082
		Post-Plating Total		0.024000	100.000000	1.971975

Wire	Pure metal	Gold (Au)	7440-57-5	0.014053	99.990000	1.154673
Wire	Impurity	Non-declarable		0.000001	0.010000	0.000082
		Wire Total		0.014054	100.000000	1.154755

		PMCXB900UEL Total		1.217054		100.000000

Notes
Report created on 2025-03-24 13:59:24 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-03-24 13:59:24 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
膠黏劑 (Adhesive)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
半導體芯片 (Die)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
預鍍層3 (Pre-Plating 3)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導線 (Wire)	?	?	?	?	?	?

?	表示該有害物質在該部件所有均質材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質至少在該部件的某一均質材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導體產品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-03-24 13:59:24 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學成分 PMCXB900UEL

雙極性晶體管

二極管

ESD保護、TVS、濾波和信號調節(jié)ESD保護

MOSFET

氮化鎵場效應晶體管(GaN FET)

絕緣柵雙極晶體管(IGBTs)

模擬和邏輯IC

汽車應用認證產品(AEC-Q100/Q101)

化學成分 PMCXB900UEL

ESD保護、TVS、濾波和信號調節(jié)ESD保護