化學(xué)成分 BSS84AKW

作為一家積極進(jìn)取的可持續(xù)發(fā)展公司，安世半導(dǎo)體已決定直接通過互聯(lián)網(wǎng)發(fā)布其產(chǎn)品組合的化學(xué)成分信息。藉由此信息，恩智浦可以向我們的客戶提供相關(guān)資料，以協(xié)助他們進(jìn)行RoHS指令或無鉛狀態(tài)合規(guī)評(píng)估。客戶可以直接從一般產(chǎn)品數(shù)據(jù)庫檢索中獲取這些詳細(xì)的數(shù)據(jù)，這是安世半導(dǎo)體為半導(dǎo)體產(chǎn)業(yè)設(shè)下的一個(gè)行業(yè)標(biāo)準(zhǔn)。安世半導(dǎo)體產(chǎn)品符合歐盟RoHS指令、ELV和中國RoHS。詳細(xì)資料請(qǐng)見限用物質(zhì)聲明。Restricted Substances Declaration.

12NC	OPN	Type No.	Package	State	MSL
934065305115	BSS84AKW,115	BSS84AKW	SOT323 (SC-70)	RFS	1

REACH	Compliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHS	Compliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 127585 ppm; substance 7440-48-4: 1508 ppm; substance 1333-86-4: 297 ppm; substance 7439-92-1: 1 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 127585 ppm; substance 7440-48-4: 1508 ppm; substance 1333-86-4: 297 ppm; substance 7439-92-1: 1 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-57-5: 455 ppm; substance 7440-22-4: 8549 ppm;
RHF Indicator	Lead-free and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die	Doped silicon	Silicon (Si)	7440-21-3	0.036412	91.030000	0.643651
Die	Pure metal layer	Aluminium (Al)	7429-90-5	0.001016	2.540000	0.017960
		Die Metallization 1 Total		0.001016	2.540000	0.017960
Die	Pure metal layer	Gold (Au)	7440-57-5	0.002572	6.430000	0.045465
		Die Metallization 2 Total		0.002572	6.430000	0.045465
		Die Total		0.040000	100.000000	0.707076

Lead Frame	Iron-nickel alloy	Iron (Fe)	7439-89-6	0.958291	47.160000	16.939607
Lead Frame	Iron-nickel alloy	Nickel (Ni)	7440-02-0	0.721766	35.520000	12.758580
Lead Frame	Iron-nickel alloy	Manganese (Mn)	7439-96-5	0.017272	0.850000	0.305315
Lead Frame	Iron-nickel alloy	Cobalt (Co)	7440-48-4	0.008534	0.420000	0.150854
Lead Frame	Iron-nickel alloy	Silicon (Si)	7440-21-3	0.005080	0.250000	0.089799
Lead Frame	Iron-nickel alloy	Chromium (Cr)	7440-47-3	0.004267	0.210000	0.075427
Lead Frame	Iron-nickel alloy	Aluminium (Al)	7429-90-5	0.001829	0.090000	0.032331
Lead Frame	Iron-nickel alloy	Carbon (C)	7440-44-0	0.000814	0.040000	0.014389
Lead Frame	Iron-nickel alloy	Sulfur (S)	7704-34-9	0.000406	0.020000	0.007177
Lead Frame	Iron-nickel alloy	Phosphorus (P)	7723-14-0	0.000406	0.020000	0.007177
		Base Alloy Total		1.718665	84.580000	30.380656
Lead Frame	Pure metal layer	Silver (Ag)	7440-22-4	0.048362	2.380000	0.854890
		Pre-Plating 1 Total		0.048362	2.380000	0.854890
Lead Frame	Pure metal layer	Copper (Cu)	7440-50-8	0.264973	13.040000	4.683899
		Pre-Plating 2 Total		0.264973	13.040000	4.683899
		Lead Frame Total		2.032000	100.000000	35.919445

Mould Compound	Filler	Silica	7631-86-9	2.426400	72.000000	42.891211
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	0.505500	15.000000	8.935669
Mould Compound	Polymer	Formaldehyde-phenol copolymer	9003-35-4	0.337000	10.000000	5.957113
Mould Compound	Additive	Non-declarable		0.097730	2.900000	1.727563
Mould Compound	Pigment	Carbon black	1333-86-4	0.001685	0.050000	0.029785
Mould Compound	Additive	Triphenylphosphine	603-35-0	0.001685	0.050000	0.029786
		Mould Compound Total		3.370000	100.000000	59.571127

Post-Plating	Tin solder	Tin (Sn)	7440-31-5	0.209979	99.990000	3.711776
Post-Plating	Impurity	Lead (Pb)	7439-92-1	0.000011	0.005000	0.000195
Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.000006	0.003000	0.000106
Post-Plating	Impurity	Copper (Cu)	7440-50-8	0.000002	0.001000	0.000035
Post-Plating	Impurity	Bismuth (Bi)	7440-69-9	0.000002	0.001000	0.000035
		Post-Plating Total		0.210000	100.000000	3.712147

Wire	Pure metal	Copper (Cu)	7440-50-8	0.005103	100.000000	0.090205
		Wire Total		0.005103	100.000000	0.090205

		BSS84AKW Total		5.657103		100.000000

Notes
Report created on 2025-03-24 13:58:03 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Pb-free Soldering		Pb Soldering		No. of Processing Cycles
PPT	MPPT	PPT	MPPT	No. of Processing Cycles
260 °C	40 s	235 °C	30 s	3

Notes
Report created on 2025-03-24 13:58:03 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

部件名稱 Material	有毒或有害物質(zhì)和元素 (Toxic or hazardous substances and elements)
部件名稱 Material	鉛 (Pb)	鎘 (Cd)	汞 (Hg)	六價(jià)鉻 (Cr⁶⁺)	多溴聯(lián)苯 (PBB)	多溴二苯醚 (PBDE)
半導(dǎo)體芯片 (Die)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層1 (Die Metallization 1)	?	?	?	?	?	?
半導(dǎo)體芯片金屬化層2 (Die Metallization 2)	?	?	?	?	?	?
基底合金 (Base Alloy)	?	?	?	?	?	?
預(yù)鍍層1 (Pre-Plating 1)	?	?	?	?	?	?
預(yù)鍍層2 (Pre-Plating 2)	?	?	?	?	?	?
模封料 (Mould Compound)	?	?	?	?	?	?
后鍍層 (Post-Plating)	?	?	?	?	?	?
導(dǎo)線 (Wire)	?	?	?	?	?	?

?	表示該有害物質(zhì)在該部件所有均質(zhì)材料中的含量均在 GB/T 26572 規(guī)定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
?	表示該有害物質(zhì)至少在該部件的某一均質(zhì)材料中的含量超出 GB/T 26572 規(guī)定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
?	該半導(dǎo)體產(chǎn)品具有無限期的環(huán)保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-03-24 13:58:03 CET+0100

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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化學(xué)成分 BSS84AKW

雙極性晶體管

二極管

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)

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化學(xué)成分 BSS84AKW

ESD保護(hù)、TVS、濾波和信號(hào)調(diào)節(jié)ESD保護(hù)